b'Figure 3. Voids structure in Sample 1, Sample 2 and Sample 3Accomplishments: X-ray instrument capability at IdahoEngineering-scale Defect Multi-scale characterization of SiCNational Laboratory (INL) can provideCharacterization using 3D porosity and cracks is accomplished,the image quality with length scalesX-ray Imagingincluding 3D X-ray global-scale, FIB/ from 10 cm to 10 -2cm, however, theIn this task, we developed a fully TEM local cross-sectional micro-scalecrack or pore less than 35 m 2(5automatic workflow to detect and local nano-scale TEM 3D tomog- pixels) cannot be detected using thisand analyze defects using image raphy. This work demonstrated thecapability. This study bridges multi- processing techniques on 3D X-ray applicability of X-ray tomographicscale characterization results by usingimages (Figure 1). Void/crack detec-imaging capability in rapidly3D tomography Scanning Transmis- tion, visualization, and analysis are supporting post-irradiation examina- sion Electron Microscopy (STEM) tothe three major components. The tions of non-fuel components. Criticalvalidate 3D XCT results and provideresults were shown in Figures 2-3. quantitative global informationmore confident qualitative informa-of the material will be obtained totion under microstructure levels. ThisFIB/SEM Characterizationevaluate the material condition andis the first work to fuse multi-scaleHigher resolution characterization performance and eventually assistcharacterization data of defects andwas conducted using dual beam FEI the decision-maker to determinecracks in SiC CMC cladding afterHelios Plasma Focused Ion Beam the material lifespan. The currenttransient safety testing at INL. on cross-sections of Sample 1 and Figure 4. Defects verification from FIB characterization of Sample 160 2023|AFC ACCOMPLISHMENTS'